IEEE

Electrical and Thermal Analysis of Bumpless Build Cube 3D Using Wafer-on-Wafer and Chip-on-Wafer for Near Memory Computing

Abstract: We propose a technology called Bumpless Build Cube (BBCube) 3D for AI and HPC applications which need high bandwidth and power efficiency. BBCube employs bumpless Wafer-on-Wafer (WoW) ...
Nanowerk

Light-based 3D printing method lets scientists program plastic properties at the microscale

Researchers have co-developed a new way to precisely control the internal structure of common plastics during 3D printing, allowing a single printed object to seamlessly shift from rigid to flexible ...
IEEE

Human-Intent-Driven Cellular Configuration Generation Using Program Synthesis

Abstract: Cellular networks are vital for emerging applications like the Metaverse, which impose demanding quality and quantity requirements. This necessitates frequent reconfiguration of both new and ...